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Inductor-less bandwidth-extension technique applied to CMOS differential trans-impedance amplifier

机译:无电感器带宽扩展技术应用于CMOS差分跨阻放大器

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To achieve a large bandwidth without inductor peaking, this work presents an inductor-less bandwidth-extension technique to establish Multi-Level Active Feedback (MLAF) structure that is used in a CMOS differential Trans-Impedance Amplifier (TIA). The proposed TIA consists of a trans-impedance stage, a low-pass filter, a gain stage, and an output buffer. The trans-impedance stage adopts the regulated cascode structure. In the gain stage, the MLAF structure which has four cascaded amplifiers and three active feedbacks in a hierarchical feedback topology is employed to effectively increase the bandwidth under a Butterworth response without inductor. The TSMC 0.18µm CMOS technology was used to implement the proposed differential TIA with a core size of 0.05mm2. Without the use of inductor peaking to enlarge the bandwidth, the proposed TIA was measured to have a bandwidth of 7.2GHz, a differential trans-impedance gain of 1.8kΩ and a minimum input sensitivity of 25µA at a bit error rate of 10−12 under 231 −1 PRBS. Comparing with conventional TIAs, the proposed TIA apparently exhibits a low hardware cost and fairly good performance for applications of 10Gbps optical communications.
机译:为了在不使电感器出现峰值的情况下实现大带宽,这项工作提出了一种无电感器的带宽扩展技术,以建立用于CMOS差分跨阻抗放大器(TIA)的多级有源反馈(MLAF)结构。拟议的TIA包括一个跨阻级,一个低通滤波器,一个增益级和一个输出缓冲器。跨阻级采用经调节的共源共栅结构。在增益阶段,采用在分层反馈拓扑结构中具有四个级联放大器和三个有源反馈的MLAF结构,可以有效地增加不带电感器的巴特沃思响应下的带宽。台积电(TSMC)0.18µm CMOS技术用于实现所建议的差分TIA,其核心尺寸为0.05mm2。在不使用电感峰值的情况下扩大带宽的情况下,建议的TIA经测量具有7.2GHz的带宽,1.8kΩ的差分跨阻增益和在10−12的误码率下的最小输入灵敏度为25µA。 231 -1 PRBS。与传统的TIA相比,拟议的TIA在10Gbps光通信应用中显然具有较低的硬件成本和相当好的性能。

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