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Modelling electromagnetic field coupling from an ESD gun to an IC

机译:模拟从ESD喷枪到IC的电磁场耦合

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IC designers require fast and accurate methods of simulating immunity of ICs to ESD events to adequately predict and analyze ESD issues. The common method of predicting electromagnetic field coupling from an ESD gun to an IC, however, requires substantial simulation time and does not typically account for the full IC layout. Here we propose an efficient methodology for calculating the electromagnetic field coupling from an ESD gun to an IC while fully considering the non-linear circuit elements in the IC core. Voltages and currents within the IC are found by merging full-wave simulations of an ESD gun with a SPICE model of the IC and the coupled electromagnetic energy. The capability of the proposed method was verified through experiments on a pseudo- integrated circuit structure. Results show the promise of the method. This hybrid modelling method can significantly accelerate simulation time compared with traditional full-wave modelling techniques and can allow the designer to better explore the variation in coupling that occurs with small changes in the test setup, such as the position and orientation of the gun and IC.
机译:IC设计人员需要快速,准确的方法来模拟IC对ESD事件的抵抗力,以充分预测和分析ESD问题。但是,预测从ESD喷枪到IC的电磁场耦合的常用方法需要大量的仿真时间,并且通常不会考虑完整的IC布局。在这里,我们提出一种有效的方法来计算从ESD喷枪到IC的电磁场耦合,同时充分考虑IC内核中的非线性电路元件。通过将ESD喷枪的全波仿真与IC的SPICE模型以及耦合的电磁能合并,可以找到IC内的电压和电流。通过在伪集成电路结构上进行的实验验证了该方法的能力。结果表明了该方法的前景。与传统的全波建模技术相比,这种混合建模方法可以大大缩短仿真时间,并且可以使设计人员更好地探索由于测试设置的微小变化(例如喷枪和IC的位置和方向)而发生的耦合变化。 。

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