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Fabrication of Nano-structures of NiTi Shape Memory Films and Investigations on Size dependence of their Mechanical Properties

机译:NiTi形状记忆膜的纳米结构的制备及其力学性能的尺寸依赖性研究

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摘要

A proper understanding of material behavior with decrease in the sample size especially at nano-scale has received significant importance in realizing MEMS devices. Ti-rich NiTi films were deposited by sputtering a NiTi alloy target (45:55) on (100) silicon substrates. Gallium ion (Ga+) Focused Ion Beam (FIB) technique has been used to create nano-structures of different dimensions and aspect ratios in these films. The influence of FIB process parameters such as ion current and etching time on etching rate and etch depth to generate various features at nano-scale is reported. The etched depths were found to be directly proportional to the ion current. The etching rate for NiTi film was 25 nm/minute approximately for a beam current of 0.35 nA. Scanning electron microscopy has been used to examine the surface morphology of etched areas of nano-pillars, pyramids and beams in different aspect ratios. Nanoindenter (Agilent Technologies G-200) has been used to investigate the young's modulus and hardness of these nanostructures and the phase transformation has been studied. In this paper, we observed that the two phases responsible for shape memory effect are more stable in nano-pillars compared to the corresponding values in bulk. Size effect on feature shape, size and aspect ratio on recovery stress values are also studied.
机译:在实现样品尺寸减小的过程中,尤其是在纳米尺度上,对材料行为的正确理解已成为实现MEMS器件的重要依据。通过在(100)硅基板上溅射镍钛合金靶材(45:55)沉积富钛的镍钛薄膜。镓离子(Ga +)聚焦离子束(FIB)技术已用于在这些膜中创建不同尺寸和纵横比的纳米结构。报道了诸如离子电流和蚀刻时间之类的FIB工艺参数对蚀刻速率和蚀刻深度的影响,以产生纳米级的各种特征。发现蚀刻深度与离子电流成正比。对于NiTi膜的蚀刻速率,对于束电流为0.35nA,约为25nm /分钟。扫描电子显微镜已用于检查纳米柱,棱锥和光束不同纵横比的蚀刻区域的表面形态。纳米压痕仪(Agilent Technologies G-200)已用于研究这些纳米结构的杨氏模量和硬度,并且已研究了相变。在本文中,我们观察到纳米柱中负责形状记忆效应的两个相与相应的整体值相比更稳定。还研究了尺寸对特征形状的影响,尺寸和长宽比对恢复应力值的影响。

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