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Characteristics Sensitivity of FinFET to Fin Vertical Nonuniformity

机译:FinFET对鳍垂直方向非均匀性的特性敏感性

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摘要

Characteristic variation of FinFET due to Fin vertical nonuniformity is simulated in this paper, based on the compact device model. This vertical nonuniformity is generated during the real etching process and induces Fin thickness variation along the height direction. Therefore, the characteristics, such as threshold voltage, sub-threshold slope, on state current, off state current and total channel resistor are investigated influenced by Fin height and deviation angle. The impact of the deviation angle on both digital and analog circuit performance is also predicted.
机译:基于紧凑型器件模型,本文模拟了由于Fin垂直不均匀性而导致的FinFET特性变化。这种垂直不均匀性是在实际蚀刻过程中产生的,并导致Fin厚度沿高度方向变化。因此,研究了鳍高和偏角对阈值电压,亚阈值斜率,导通电流,截止状态电流和总沟道电阻等特性的影响。还可以预测偏差角对数字和模拟电路性能的影响。

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