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Developing and Modeling a plane 3 DOF Compliant Micromanipulator by means of a dedicated MBS code

机译:通过专用MBS代码开发和建模符合3 DOF平面的微操纵器

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In the present investigation, a new Multi-Body System code has been introduced for studying the static and dynamic analysis of micro-compliant mechanisms. Since the first natural frequency of elastic microsystems can be expected to be quite high, the integration time was significantly reduced and the step time interval was also reduced during integration. The code applies the Lagrange Multiplier method of dynamic analysis to the pseudo-rigid body model of the compliant microsystem, the latter being obtained by imposing the centers of the revolute joints of the model be coincident with the centers of the elastic weights of the flexural arcs of the real system. The actual construction of one-to-one scaled prototypes have been also described as a first step to a possible future comparison of the code results and the MEMS real behaviour. For this reason, two adopted construction techniques have been described: copper electro deposition and RIE on silicon
机译:在当前的调查中,已经引入了新的多体系统代码,用于研究微顺应性机制的静态和动态分析。由于可以预料到弹性微系统的第一个自然频率很高,因此在集成过程中,集成时间显着减少,步长时间间隔也缩短了。该代码将动态分析的Lagrange乘数方法应用于顺应性微系统的拟刚体模型,后者是通过将模型的旋转接头的中心与弯曲弧的弹性权重的中心重合而获得的真实系统。一对一缩放原型的实际构造也已被描述为对代码结果和MEMS实际性能进行可能的未来比较的第一步。因此,已经描述了两种采用的构造技术:铜电沉积和硅上的RIE。

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