首页> 外文会议>Silicon Carbide and Related Materials 2007 >Structure analysis of in-grown stacking faults and investigation of the cause for high reverse current of 4H-SiC Schottky Barrier Diode
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Structure analysis of in-grown stacking faults and investigation of the cause for high reverse current of 4H-SiC Schottky Barrier Diode

机译:4H-SiC肖特基势垒二极管内生堆叠故障的结构分析及反向电流高的原因研究

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摘要

Two types of structures related to in-grown SF having a different influence on reverse currents of 4H-SiC SBDs were investigated. One type contained only a single SF formed by 1c of 8H poly-type and showed low reverse currents. The other type was accompanied with short SFs which consisted of 3C poly-type in addition to two SFs formed by lc of 8H poly-type and showed high reverse currents. SF formed by lc of 8H poly-type was not the cause of the high reverse current, and we speculate that the barrier height lowering at the short SF attributed to the high reverse currents of SBDs.
机译:研究了与向内生长的SF相关的两种类型的结构,这些结构对4H-SiC SBD的反向电流有不同的影响。一种类型仅包含由1c的8H多型形成的单个SF,并且显示出低反向电流。另一类伴随着短的SF,其由3C多型组成,除了两个由8H多型的1c形成的SF外,还显示出高反向电流。由8H多晶型的lc形成的SF并不是高反向电流的原因,我们推测在短SF时势垒高度降低是SBD反向电流高的原因。

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