首页> 外文会议>2007 8th International Conference on Electronics Packaging Technology >The Application of a Type of Electric Pastern in the Bonding Technique of the Microcircuit Board
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The Application of a Type of Electric Pastern in the Bonding Technique of the Microcircuit Board

机译:一种电焊条在微电路板粘接技术中的应用

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The authors have performed experiments in the felting of electric pasterns upon the samples of aluminum alloy boards,gold-plating boards and glass strips, the method of which is to first felt 2 microcircuit boards with electric pastern and fix them with some mechanical devices, then keep them in the drying blast oven for 4 hours with a constant temperature of 150+2°C and finally, cool them naturally to the ambient temperature. The series of experiments made include the testing of the extension and cutting intensity of the electric pastern, the testing of the volume resistivity of the electric pastern and the experiment of the concussion given to the electric pastern at relatively high or low temperatures, the purpose of which is to test the reliability of its felting quality and further to study the application of the electric pastern in the bonding technique of the microcircuit board. Obtained from the testing of extension intensity carried out with the relevant testing machine according to GB7124- 86, the testing value of aluminum alloy board is between 5.5M Pa and 6.99 M pa, the testing value of the gold-plating board is from 2.45M Pa to 3.07M Pa, which clearly mean that the joining intensity of electric pastern to aluminum alloy board is better than that to the gold-plating board. However, both intensities have met our demands and are acceptable. We also have tested the volume resistivity of the glass strips connected to it. Since for the bonding technique of the microcircuit board, it is usually acceptable if the resistivity of the electric pastern is less than 9.0× 10-4 Q.cm, our testing data have shown that the quality of this type of electric pastern is satisfactory. Having fulfilled the concussion test for the microcircuit board at relatively high or low temperatures, we have tested the reliability of the bonding points. The finding shows that the change of the resistivity of the microcircuit board is within very small scale, and if assigned to every felting point, the change can simply be ignored, thus cannot affect the felting quality at all. To sum up, the series of experiments have given the proof that this type of electric pastern meets the requirements of the bonding technique of the microcircuit board connected by gold threads or gold bands.
机译:作者已经对铝合金板,镀金板和玻璃带的样品进行了电动胶粘剂的毡合实验,方法是先用电动胶粘剂将2个微电路板毡合起来,然后用一些机械装置将它们固定,然后将它们在150±2°C的恒温箱中于鼓风干燥箱中放置4个小时,最后将其自然冷却至环境温度。进行的一系列实验包括测试电蜡笔的延伸和切割强度,测试电蜡笔的体积电阻率以及在较高或较低的温度下对电蜡笔进行脑震荡的实验,目的是这是为了检验其毡制质量的可靠性,并进一步研究电胶在微电路板粘接技术中的应用。从有关测试机按GB7124-86进行拉伸强度测试得出,铝合金板的测试值在5.5M Pa至6.99 M pa之间,镀金板的测试值在2.45M以上Pa达到3.07M Pa,这显然意味着电蜡笔与铝合金板的连接强度要比对镀金板的连接强度好。但是,两种强度都满足了我们的要求并且可以接受。我们还测试了与其相连的玻璃带的体积电阻率。由于对于微电路板的粘合技术,如果电蜡笔的电阻率小于9.0×10-4 Q.cm通常是可以接受的,因此我们的测试数据表明这种电蜡笔的质量令人满意。在相对较高或较低的温度下完成了微电路板的冲击测试后,我们已经测试了连接点的可靠性。该发现表明,微电路板的电阻率变化在很小的范围内,并且如果将其分配给每个毡合点,则可以简单地忽略该变化,因此根本不会影响毡合质量。综上所述,一系列的实验证明了这种电蜡膏满足了通过金线或金带连接的微电路板的粘接技术的要求。

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