1. Recommended Sn-3.9Ag-0.6Cu (+/-0.2) for reflow, Sn-0.7Cu for wave in Oct. 1999. 2. Test plan 75% complete for SnAgCu solder reliability. 3. Working with JEDEC committee on development of appropriate component specs. 4. Defined reflow profile for component evaluations. 5. Working with ITRI(U.S.) on PCB issues. 6. Plan to complete project and reports by Oct/Nov 2001. 7. APEX presentation of results (January 2002, San Diego). (1) Implementation decision up to member companies. (2) Investment will be required by companies to go to lead-free.
展开▼
