A new cladding process has been developed by means of a surface activated bonding technique. The metal sheets to be bonded are cleaned by Ar plasma ion etching activated and rolled with low distortion at room temperature in vacuum. In many respects, the clad sheets manufactured by this process have advantages over conventional clad sheets. For instance, they have a clean and flat interface without intermetallic alloy layer. Thin metal foil (10 /spl mu/m/spl sim/thickness) can be bonded with the metal sheet. The multi layer clad sheet produced by this process can be formed easily by selective chemical etching method Therefore, the sheet makes it possible to design a fine and solid conductive circuit with bump only through the chemical etching process.
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机译：已经通过表面活化结合技术开发了一种新的覆层工艺。待接合的金属板通过激活的Ar等离子离子蚀刻进行清洁，并在室温下，真空下以低变形轧制。在许多方面，通过该方法制造的覆层板具有优于常规覆层板的优点。例如，它们具有干净且平坦的界面，没有金属间合金层。可以将薄金属箔（10 / spl mu / m / spl sim /厚度）与金属板粘合。通过这种方法制造的多层复合板可以通过选择性化学蚀刻方法容易地形成。因此，该板使得可以仅通过化学蚀刻工艺来设计具有凸点的精细且牢固的导电电路。
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