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Preparing TEM sections by FIB: stress relief to straighten warping membranes

机译:用FIB准备TEM部分:应力缓解,拉直翘曲膜

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Stresses in a TEM section can cause considerable problems, both in the preparation of the section and in the subsequent microscopy. As the FIB thins a stressed specimen, warping occurs as the section offers less resistance because of reduced rigidity. Compressive stress is relieved as the membrane finds its own length through excessive local bending. Cutting the membrane at one end allows the thinned region to expand into the cut without the necessity to bend out of the original plane. The membrane straightens for further thinning or TEM observation. Under exceptional circumstances, residual strain can prevent complete straightening of the membrane. In this case both sides of the membrane can be freed to allow complete relaxation. This has always been sufficient to allow completion of the thinning and a full TEM examination.
机译:TEM部分的应力会在制备部分和随后的显微镜中产生相当大的问题。当FIB绑在压力标本中时,由于截面降低,因此由于该截面提供较少的阻力而发生翘曲。随着膜通过过量的局部弯曲发现其自身的长度,释放压缩应力。在一端切割膜允许稀释区域扩展到切口中而不需要弯出原始平面。膜伸直以进一步变薄或视图观察。在特殊情况下,残留的菌株可以防止膜完全矫直。在这种情况下,膜的两侧可以释放以允许完全放松。这一直足以允许完成变薄和完整的TEM检查。

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