An environmental comparison of solder and conductive adhesives for SMT interconnect

机译：用于SMT互连的焊料和导电胶的环境比较

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The results of a comparative study of traditional tin-lead solder and the alternatives, namely lead free solders and conductive adhesives are presented. The comparison is made in light of impending European legislation for product "ecodesign" and "ecoproduction", which may later by embodied in legislation. Conductive adhesives appear to present opportunities from an environmental viewpoint.

机译：介绍了对传统锡铅焊料及其替代品（即无铅焊料和导电胶）的比较研究结果。比较的依据是即将颁布的有关产品“生态设计”和“生态生产”的欧洲法规，这些法规以后可能会体现在立法中。从环境的角度看，导电粘合剂似乎提供了机会。

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《Electronic Manufacturing Technology Symposium, 1993, Fifteenth IEEE/CHMT International》|1993年|P.171-176|共6页
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Conway; P.P.;
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中图分类无线电电子学、电信技术;
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4. An environmental comparison of solder and conductive adhesives for SMT interconnect [C] . Conway P.P., Institute of Electric and Electronic Engineer IEEE/CHMT International Electronic Manufacturing Technology Symposium . 1993

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5. Novel conductive adhesives for electronic packaging applications: A way towards economical, highly conductive, low temperature and flexible interconnects [D] . Zhang, Rongwei 2011

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An environmental comparison of solder and conductive adhesives for SMT interconnect

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