1991 Proceedings. 41st Electronic Components and Technology Conference (Cat. No.91CH2989-2)

摘要

The following topics are dealt with: advanced inorganic materials and processes; optoelectronic packaging and passive devices; packaging modeling and characterization; hybrid applications and advanced substrates; single chip packaging; connectors; TAB (tape automated bonding) and wire interconnect; polyimides and other organic materials; solder material; packaging reliability; multichip modules; flip chip/solder reliability; and interconnect reliability. Abstracts of individual papers can be found under the relevant classification codes in this or other issues.