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An on-chip load model for off-chip PDN analysis considering interdependency between supply voltage, current profile and clock latency

机译:考虑到电源电压,电流分布和时钟延迟之间的相互依赖性,用于片外PDN分析的片上负载模型

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Simple yet accurate on-chip load model is demanded for off-chip power delivery network (PDN) design and verification. Conventionally, a current source that represents a short chip operation period is used for this purpose, but it cannot consider the interdependency between supply voltage, load current and clock latency. The ignorance of this interdependency could mislead off-chip PDN design causing over- and under-design. To address this issue, this paper proposes an on-chip load model with Verilog-A that can replay the load current and clock latency under dynamic supply noise. The model is expanded to support different chip operation modes, and it can be used as a sub-model to construct a large chip model. Experiment shows over 200X run-time improvement comparing with full SPICE netlist simulation. We also confirm that the current profile, power consumption, and clock latency are closely correlated.
机译:片外功率传输网络(PDN)设计和验证需要简单而准确的片上负载模型。传统上,代表较短芯片工作周期的电流源用于此目的,但它不能考虑电源电压,负载电流和时钟等待时间之间的相互依赖性。对这种相互依赖性的无知可能会误导片外PDN设计,从而导致设计过度和设计不足。为了解决这个问题,本文提出了一种采用Verilog-A的片上负载模型,该模型可以重播动态电源噪声下的负载电流和时钟延迟。该模型被扩展以支持不同的芯片操作模式,并且可以用作构建大型芯片模型的子模型。实验显示,与完整的SPICE网表仿真相比,运行时间改进了200倍以上。我们还确认当前配置文件,功耗和时钟延迟密切相关。

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