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Viscoelastic Properties of Thixotropic Semisolid Alloy Relating the Microstructure

机译:触变半固态合金的粘弹性与显微组织的关系

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The subject of this work is to investigate viscoelastic properties such as loss modulus (G"), storage modulus (G'), complex shear modulus (G*), complex viscosity (η*) and loss angle (δ) at different temperatures by means of a small-amplitude oscillatory test. These properties allow to provide information about materials structure. For this purpose, we employed a tin-lead alloy (Sn-15%Pb) which exhibits a similar microstructure to aluminum alloys and is the classic alloy for semisolid thixotropic studies. It is interesting to note that the Sn-15%Pb alloy exhibits a slightly decrease in storage modulus (G') over the entire frequency (0.01-10Hz) at high temperatures, showing its viscoelastic behavior. In addition, a detailed analysis of master curves (oscillatory tests) was made to relate the semisolid microstructure (solid fraction) with the plateau modulus (Gn°) which is directly related with both molecular weight or percolation threshold in polymer and gels science respectively.
机译:这项工作的主题是研究粘弹性特性,例如在不同温度下的损耗模量(G“),储能模量(G'),复剪切模量(G *),复粘度(η*)和损耗角(δ)。这些特性可以提供有关材料结构的信息,为此,我们使用了一种锡-铅合金(Sn-15%Pb),它的显微组织与铝合金相似,是经典的合金。在半固态触变研究中,有趣的是,Sn-15%Pb合金在高温下整个频率(0.01-10Hz)的储能模量(G')略有下降,显示出其粘弹性。进行了主曲线的详细分析(振动测试),以将半固体的微观结构(固体分数)与平稳模量(Gn°)相关,该平稳模量分别与聚合物和凝胶科学中的分子量或渗滤阈值直接相关。

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