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Integrated circuit ESD protection structure failure analysis based on TLP technique

机译:基于TLP技术的集成电路ESD保护结构失效分析

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This paper introduces an evaluation method of integrated circuit port protection structure burn-out mechanism basing on transmission line pulse test (TLP). Based on the analysis of a variety of typical ESD protection circuit structures of integrated circuit, the design procedure of TLP test scheme is provided. By establishing functional relation between I/V characteristic curves and the ESD damage failure of protection circuit, the level and consequence of integrated circuit ESD failure can be quantified precisely, the root causes also can be confirmed. With a failure analysis case of a typical clamp protection structure of 0.18μm process verifies the feasibility of the technique.
机译:介绍了一种基于传输线脉冲测试(TLP)的集成电路端口保护结构烧坏机制的评估方法。在分析了各种典型的集成电路ESD保护电路结构的基础上,提出了TLP测试方案的设计程序。通过建立I / V特性曲线与保护电路ESD损坏故障之间的函数关系,可以精确地量化集成电路ESD故障的程度和后果,也可以确定根本原因。通过对典型的0.18μm钳位保护结构进行故障分析,证明了该技术的可行性。

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