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Power core (PC) embedding a plurality of IC devices and sandwiched between two insulated metal substrates (IMS'): Predicted thermal stresses

机译:嵌入多个IC器件并夹在两个绝缘金属基板(IMS')之间的功率核(PC):预测的热应力

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Power core (PC) sandwiched between two insulated metal substrates (IMS) and embedding active and passive IC devices is currently viewed as an attractive advanced packaging option having a strong potential in the automotive industry and beyond. A natural reliability concern, however, is the level of the thermally induced stresses in a multi-material assembly of the type in question. Accordingly, an analytical (mathematical) stress model is developed for the evaluation of these stresses. The stresses include normal stresses acting in the cross-sections of the assembly components, and the shearing and peeling stresses acting at the interfaces of these components and at the embedded devices. The model can be helpful in the stress analysis and physical design of the assemblies, in which the PC is sandwiched between two IMS'. It can be used also in other areas of engineering, where tri-material assemblies comprised of dissimilar materials and subjected to the change in temperature are employed. The general concepts are illustrated by a detailed numerical example. The analysis is an extension of the study carried out earlier for a bow-free assembly. It is noteworthy that although the calculations are carried out for the case when the assembly is cooled down from an elevated temperature to a low temperature, the developed model is equally applicable to any change in temperature, as long as the linear approach is used and the stresses are proportional to the change in temperature, whatever its sign or the magnitude is.
机译:夹在两个绝缘金属基板(IMS)之间并嵌入有源和无源IC器件的功率核(PC)当前被视为具有吸引力的高级封装选项,在汽车行业及其他行业具有巨大潜力。但是,自然而然的可靠性问题是所讨论类型的多材料组件中的热感应应力水平。因此,开发了一种分析(数学)应力模型来评估这些应力。应力包括作用在组装组件横截面中的法向应力,以及作用在这些组件的界面和嵌入式设备上的剪切应力和剥离应力。该模型可用于组件的应力分析和物理设计,其中PC夹在两个IMS'之间。它也可以用在工程的其他领域,在这些领域中,使用了由异种材料组成并经受温度变化的三材料组件。通过详细的数值示例说明了一般概念。该分析是先前对无弓形装配进行的研究的扩展。值得注意的是,尽管计算是针对将组件从高温冷却到低温的情况进行的,但只要使用线性方法并且采用线性方法,开发的模型同样适用于任何温度变化。应力与温度的变化成正比,无论其符号或大小如何。

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