Ultra-precision Machining of Surfaces of Elements of Devices from Optical Materials

摘要

Optical materials are widely used in the composition of modern engineering products and aerospace and electronics industries. At the same time, optical surface processing quality is ensured only with the use of diamond cutting tools and ultra-precision ultra-rigid equipment. In addition, it is necessary to provide cutting conditions in the nanoscale thickness range of the cut layer. The results of theoretical and experimental studies aimed at improving the performance, accuracy, and quality of machining surfaces of elements of devices from optical materials (reducing the roughness and depth of fractured layer), potassium dihydrophosphate (KDP), Sitall, quartz glass, by using diamond cutter and abrasive diamond tools, are presented in the chapter. Kinematic schemes of ultra-precise machining of optical surfaces and the basic theoretical dependences for calculation of cutting layer thickness are considered. Recommended cutting modes and conditions are presented. The examples of diamond milling and abrasive processing on ultra-precise experimental stands and results of metrological control of treated surface quality parameters are also given.