首页> 外文会议>IEEE International Nanoelectronics Conference >Optimizing the electroplating condition of an acid low cyanide silver bath and its application in micromachining
【24h】

Optimizing the electroplating condition of an acid low cyanide silver bath and its application in micromachining

机译:酸性低氰银镀液的电镀条件优化及其在微加工中的应用

获取原文
获取外文期刊封面目录资料

摘要

In this paper, an acid low cyanide silver bath was introduced for producing silver film. The effect of current density and temperature of bath on the properties of silver film was studied. Through analyzing the crystalline grains and average roughness of silver film, the optimum current density and temperature were and 3mA/cm2 and 15°C. Then the patterning silver film was obtained by micromachining process under the optimum electroplating condition. The width of patterned photoresist was the same with the width of silver film which indicated it could be compatible with micromachining process.
机译:本文介绍了一种酸性低氰化物银浴,用于生产银膜。研究了电流密度和熔池温度对银膜性能的影响。通过分析银膜的晶粒和平均粗糙度,最佳电流密度和温度分别为3mA / cm2和15°C。然后在最佳电镀条件下,通过微加工工艺获得图案化的银膜。图案化光致抗蚀剂的宽度与银膜的宽度相同,表明它可以与微加工工艺兼容。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号