Effect of 0.8 wt Al2O3 nanoparticles addition on the microstructures and electromigration behavior of Sn-Ag-Cu solder joint

摘要

In this study, 0.8 wt% AlO nanoparticles doping Sn3.0Ag0.5Cu (SAC) lead-free solder was prepared through the powder metallurgy route. The microstructures and the electromigration (EM) behavior of the composite solder joints were then studied by an environment scanning electron microscopy (ESEM). After 0.8 wt% AlO nanoparticles addition, finer microstructure with smaller β-Sn grains was obtained in the composite solder matrices in comparison to the unreinforced SAC solder. In addition, the electromigration analysis indicates the addition of AlO nanoparticles could effectively suppress the dissolution of intermetallic compound (IMC) and the formation of voids at the cathode as well as the growth of IMC at the anode induced by electromigration.