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Simulation analysis of grinding wheel motion trajectory on SiC ceramics aspheric surface grinding

机译:SiC陶瓷非球面磨削砂轮运动轨迹的仿真分析

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In grinding process of SiC ceramics aspheric surface, the motion trajectory of grinding wheel has great influence on the surface forming. The paper provides mathematical models of grinding wheel movements; analytical simulation was done to describe the trajectories of the grinding wheel in manufacturing an aspherical workpiece. The effect of grinding parameters (including the rotation speed of the workpiece, the feed rate of grinding wheel etc.) on the aspheric surface coverage rate was conducted and discussed in detail. An experimental study was done according to the simulation results and an aspheric surface with form error less than 10μm was gained.
机译:在SiC陶瓷非球面磨削过程中,砂轮的运动轨迹对表面成形有很大影响。本文提供了砂轮运动的数学模型。进行了分析模拟,以描述制造非球面工件时砂轮的轨迹。进行并详细讨论了磨削参数(包括工件的转速,砂轮的进给速度等)对非球面覆盖率的影响。根据仿真结果进行了实验研究,获得了形状误差小于10μm的非球面。

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