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A low-loss and broad-band LTCC BPF using a patch resonator for 60 GHz system-on-package (SoP) applications

机译:使用贴片谐振器的低损耗和宽带LTCC BPF,用于60 GHz系统上包装(SOP)应用程序

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摘要

A three-dimensional (3-D) low-loss and wideband BPF based on low-temperature co-fired ceramic (LTCC) has been presented for 60 GHz wireless communication applications. For a low-loss and broad-bandwidth characteristics of the BPF, via pads as an additional resonator in the vertical via transitions are designed. The proposed BPF has been designed by investigating its characteristics as a function of dimensions of the resonators using a single-mode patch and via. The designed BPF was fabricated in a 6-layer LTCC dielectric. The fabricated BPF shows a centre frequency (fc) of 61.46 GHz and a 3dB fractional bandwidth of 10.5 % from 58.2 to 64.7 GHz (6.47 GHz). An insertion loss of −2.88 dB at fc and return losses below −10 dB are achieved. Its whole size is 4.72 × 1.7 × 0.684 mm3.
机译:已经提出了一种基于低温共用陶瓷(LTCC)的三维(3-D)低损耗和宽带BPF用于60 GHz无线通信应用。 对于BPF的低损耗和宽带宽特性,设计了通过焊盘作为垂直通孔过渡的附加谐振器。 通过使用单模贴片和通过谐振器的尺寸的函数来研究其特性,设计了所提出的BPF。 设计的BPF在6层LTCC电介质中制造。 制造的BPF显示了61.46GHz的中心频率(FC),3DB分数带宽为5.5%,从58.2到64.7 GHz(6.47 GHz)。 &#x2212的插入损耗;在fc和下面的返回损耗下的2.88 dB−实现了10 dB。 它的整个尺寸为4.72× 1.7× 0.684 mm 3

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