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Large-scale and low-cost production of graphene nanosheets-based epoxy nanocomposites with latent catalyst to enhance thermal conductivity for electronic encapsulation

机译:具有潜催化剂的基于石墨烯纳米片的环氧纳米复合材料的大规模和低成本生产,提高电子封装的导热率

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High density and high-power integrated circuits require fast heat dissipation electronic encapsulation martials. epoxy composites are one of the most common materials in packaging areas. However, epoxy have low thermal conductivity value. Graphene nanosheets are the good option to combine with epoxy to enhance the thermal conductivity due to its high thermal conductivity value (3000 - 5000 W/mK). In this paper, graphene nanosheets fabricated by liquid exfoliation of graphite powders were proposed. We combined low-energy ball milling and sonication methods to produce graphene nanosheets on a large scale. The surfactant sodium dodecyl sulfate (SDS) has been used as the stabilizer to prevent graphene nanosheets from aggregating. Additionally, the latent catalyst was used in epoxy composites during the curing process. It was obviously that latent catalyst plays the role of accelerator in the epoxy curing at specific curing temperature, which could provide effective control of curing process by heating. Also, it provided better storage ability for epoxy composites. The graphene-epoxy composites achieved higher thermal conductivity which was enhanced 225% compare to pure epoxy, which has the potential to be applied in heat management materials of electronic encapsulation.
机译:高密度和高功率集成电路需要快速散热电子封装武术。环氧复合材料是包装区域中最常见的材料之一。然而,环氧树脂具有低导热率值。石墨烯纳米片是结合环氧树脂的良好选择,以增强由于其高导热率值(3000-5000W / MK)而增强导热率。本文提出了石墨粉末制造的石墨烯纳孔。我们将低能量球磨和超声处理方法组合在大规模上生产石墨烯纳米片。表面活性剂十二烷基硫酸钠(SDS)已被用作稳定剂,以防止石墨烯纳米蛋白酶聚集。另外,在固化过程中,潜伏催化剂用于环氧复合材料。显然,潜在催化剂在特异性固化温度下发挥促进剂在环氧树脂固化中的作用,这可以通过加热提供有效控制固化过程。此外,它为环氧复合材料提供了更好的存储能力。石墨烯 - 环氧复合材料达到较高的导热率,其与纯环氧树脂相比增强了225%,这具有应用在电子封装的热管理材料中的可能性。

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