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Improving the Forward Current of P-N Diode Using Soft X-ray Annealing Method

机译:软X射线退火方法改善P-N二极管的前电流

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This paper presents a new result to improve the performance of P-N diode. The P-N diodes are fabrication using CMOS technology at TMEC. Electrical characteristics of P-N junction diode can be analyzed by current-voltage (I-V) measurement. This paper investigates X-ray irradiation by its electrical characteristics of difference X-ray exposure time. The X-ray energy use to expose 55 and 70 keV various time in the range 5-205 sec of exposure. After X-ray irradiation the forward current are increased about 3-4 orders. The series resistance and recombination lifetime are main factor for describe the change of forward current. Series resistance after X-ray irradiation with 55 and 70 keV are decreased from 10 kΩ to 5 Ω, which show that the device performance of diode are increased after X-ray irradiation. While the recombination lifetime are decreased from 55 to 48 μsec and 52 to 45 μsec at 55 and 70 keV, respectively. From the results show that soft X-ray annealing is very important to semiconductor industry.
机译:本文提出了提高P-N二极管性能的新结果。 P-N二极管在TMEC时使用CMOS技术制造。可以通过电流 - 电压(I-V)测量分析P-N结二极管的电气特性。本文研究了X射线照射的差异X射线暴露时间的电气特性。 X射线能量用于暴露55和70 kev各种时间在5-205秒的暴露范围内。 X射线照射后,前电流增加约3-4个订单。串联电阻和重组寿命是描述正向电流变化的主要因素。 X射线照射55和70keV后的串联电阻从10kΩ降低至5Ω,表明X射线照射后二极管的器件性能增加。虽然重组寿命在55至48μSEC中分别在55至48μSEC下降55至48μSEC,分别为55和70keV。结果表明,软X射线退火对半导体工业非常重要。

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