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A Configurable SRAM with Constant-Negative-Level Write Buffer for low-Voltage Operation with 0.149μm~2 Cell in 32nm High-K Metal-Gate CMOS

机译:一种可配置的SRAM,具有恒定负级写缓冲器,用于低压操作,32nm高k金属门CMOS中的0.149μm〜2电池

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This paper presents a configurable SRAM for low-voltage operation with constant-negative-level write buffer (CNL-WB) and level programmable wordline driver for single supply (LPWD-SS) operation. CNL-WB is suitable for compilable SRAMs and it improves write margin by featuring an automatic BL-level adjustment for configuration range of four to 512 cells/BL using a replica-BL technique. LPWD-SS optimizes the tradeoff between disturb and write margin of a memory cell, allowing a 60% shorter WL rise time than that of the conventional design [1] at 0.7V. A test-chip is fabricated in a 32nm high-κ metal-gate CMOS technology with a 0.149μm~2 6T-SRAM cell. Measurement results demonstrate a cell-failure rate improvement of two orders of magnitude for an array-configuration range of 64 to 256 rows by 64 to 256 columns.
机译:本文介绍了一种可配置的SRAM,用于低压操作,具有恒负级写缓冲区(CNL-WB)和用于单电源(LPWD-SS)操作的级别可编程字体驱动器。 CNL-WB适用于可编译的SRAM,它通过使用Replica-BL技术具有四到512个单元/ BL的配置范围的自动BL级调整来提高写余量。 LPWD-SS优化了记忆单元的干扰和写余量之间的权衡,允许在0.7V时比传统设计的60%更短的WL上升时间。用0.149μm〜2 6T-SRAM细胞的32nm高κ金属栅极电栅CMOS技术制造测试芯片。测量结果表明,对于64到256行的阵列 - 配置范围为64至256列的阵列的两个级别的单元故障率提高。

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