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Detecting Cracks in Ceramic Matrix Composites by Electrical Resistance

机译:用电阻检测陶瓷基复合材料中的裂纹

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摘要

The majority of damage in SiC/SiC ceramic matrix composites subjected to monotonic tensile loads is in the form of distributed matrix cracks. These cracks initiate near stress concentrations, such as 90° fiber tows or large matrix pores and continue to accumulate with additional stress until matrix crack saturation is achieved. Such damage is difficult to detect with conventional nondestructive evaluation techniques (immersion ultrasonics, x-ray, etc.). Monitoring a specimen's electrical resistance change provides an indirect approach for monitoring matrix crack density. Sylramic-iBN fiber- reinforced SiC composites with a melt infiltrated (MI) matrix were tensile tested at room temperature. Results showed an increase in resistance of more than 500% prior to fracture, which can be detected either in situ or post-damage. A relationship between resistance change and matrix crack density was also determined.
机译:承受单调拉伸载荷的SiC / SiC陶瓷基复合材料中的大部分损坏是以分布的基体裂纹的形式出现的。这些裂纹在接近应力集中时开始,例如90°纤维束或较大的基体孔隙,并随着额外的应力继续累积,直到达到基体裂纹饱和为止。使用传统的非破坏性评估技术(浸入式超声波,X射线等)很难检测到这种损坏。监测样品的电阻变化提供了一种间接的方法来监测基体裂纹密度。在室温下对具有熔体渗透(MI)基体的Sylramic-iBN纤维增强SiC复合材料进行了拉伸测试。结果表明,断裂前的电阻增加了500%以上,可以在原位或损坏后检测到。还确定了电阻变化与基体裂纹密度之间的关系。

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