Investigation of benzenethiol (BT) materials as adhesion promoter for Cu/Epoxy interface using molecular dynamic simulation

摘要

Cu/Epoxy is known as one of the weakest joint in the electronic packages. Due to the lack of adhesion, the copper and epoxy encapsulant interface is prone to delaminate, and failure will happen in electronic devices. To solve this problem, the thiol-based self-assembled molecular (SAM) treatment is introduced by our group. The benzene ring will give the hydrophobic characteristic to the surface up on the formation of thiol layer. The selected thiol functional group will react with copper substrate. The other end of benzenethiol materials are designed to react with epoxy composite to build a chemical bridge between copper and epoxy.