Life Predict and Simulation of the Copper Wire in Flexible Printed Circuit Board

摘要

Fatigue failure of the circuit board's research focuses on the influence to the circuit board of vibration of rigid circuit board type, distribution of Electronic Components on the board etc. And there is relatively little research to the flexible circuit board's fatigue life research. Local stress-strain method is used to predict the fatigue life. Simulate actual fatigue test load conditions to established finite element model of flexible printed circuit board. Perform fatigue analysis under the periodicity stress. Drawn fatigue life of copper wire in different loading conditions. There is guiding significance to the follow-up test.