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MODELING AND SIMULATION OF DUAL SCALE FLOW IN WOVEN OR STITCHED PREFORMS IN LIQUID MOLDING PROCESSES

机译:液态模制过程中机织或缝合预成型坯的双尺度流动的建模和模拟

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In Liquid Composite Molding (LCM) processes, most fabrics used contain fiber bundles called as fiber tows that are woven or stitched in a bi-directional weave. The resin impregnates the fiber tows at much slower rate than the regions in between the fiber tows due to the higher fiber volume fraction in the tows. This introduces a host of new issues that one must address in modeling and simulation to manufacture a void free part. The most important being that in addition to filling the regions in between the fiber tows, we also need to ensure the saturation of fiber tows with resin. In practice, this is achieved by letting the resin bleed through the vent after the resin reaches the vent in order to allow sufficient time for the fiber tows to saturate. Modeling this phenomenon will provide an estimate on the dwell time necessary for bleeding to saturate the tows and also make it possible to explore process innovations such as attaching additional resistance at the vent to reduce the dwell time. This paper will present the methodology of how we introduce the dual scale flow in our simulation and investigate the benefits of attaching additional resistance at the vent. Two composite panels are manufactured using the VARTM process with and without the use of vent resistance. Sections of the panel are examined for void content using an optical microscope and image analysis. The void content is found to be less when a vent resistance is used. Numerical simulation of the dual scale media is able to validate this trend qualitatively.
机译:在液体复合成型(LCM)工艺中,大多数使用的织物都包含称为纤维束的纤维束,这些纤维束以双向编织的方式编织或缝合在一起。由于纤维束中较高的纤维体积分数,因此树脂以比纤维束之间的区域慢得多的速率浸渍纤维束。这引入了许多新问题,必须在建模和仿真中解决这些问题才能制造出无空隙的零件。最重要的是,除了填充纤维束之间的区域外,我们还需要确保树脂使纤维束饱和。实际上,这是通过在树脂到达通风口后让树脂从通风口渗出来实现的,以便有足够的时间使纤维束饱和。对这种现象进行建模将提供对出血以使丝束饱和所需的停留时间的估计,并使探索工艺创新成为可能,例如在排气孔处增加额外的阻力以减少停留时间。本文将介绍在仿真中如何引入双刻度流的方法,并研究在通风口处附加阻力的好处。使用和不使用通风阻力的情况下,使用VARTM工艺制造了两块复合板。使用光学显微镜和图像分析检查面板部分的空隙含量。当使用排气电阻时,发现空隙含量较少。双尺度介质的数值模拟能够定性地验证这种趋势。

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