NEW TECHNOLOGY WATERLESS CLEANING APPROACH FOR HIGH DENSITY ASSEMBLIES AND POWER ELECTRONICS

摘要

Packaging trends enable disruptive technologies. The miniaturization of components reduces the distance between conductive paths. Cleanliness of electronic hardware based on the service exposure of electrical equipment and controls can improve the reliability and cost effectiveness of the entire system. Problems resulting from leakage currents and electrochemical migration lead to unintended power disruption and intermittent performance problems due to corrosion issues and ultimately field failures and returns. Solvent cleaning has a long history of use for cleaning electronic hardware, however largely due to environmental issues this approach fell out of favor in the 1990's. The rapid evolution of no clean and lead free fluxes further entrenched aqueous cleaning as the cleaning technology of choice which largely continues to this day. However, the relentless advancement of smaller form factors and higher performance requirements presents situations where a waterless process would provide technical benefits. To address these limitations, new solvent cleaning agents and processes have been designed to clean highly dense assemblies and power electronics. The research study will evaluate the cleaning and electrical performance using the IPC B-52 Test Vehicle. Lead Free no-clean solder paste will be used to join the components to the test vehicle. Ion Chromatography and SIR values will be reported.