Novel Interconnection Materials for High Reliable Power Converters with Operation Temperatures above 150°C

摘要

Power semiconductor modules are used in a wide field of applications and power ranges. The main trends for these devices are miniaturization and cost reduction,which leads to new requirements for dies,substrates and interconnect materials.Increasing power density and therefore temperature in power packages extends the current operation temperature limit of 150°C and new interconnect mate-rials are needed to further improve the performance of DCB packages.High thermal and electrical conductivity are main requirements for excellent thermo mechanical stability and heat dissipation. The novel mAgic sinter materials can be used for operation temperatures above 150°C. They exhibit highest electrical and thermal conductivity and therefore provide a solution to reduce size and cost of high power semiconductor modules and,at the same time, they improve the overall performance and reliability of these packages.