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Electrical Characteristics of 100 MeV 28Si implantation in GaAs

机译:GaAs中100 MeV 28Si注入的电学特性

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Single crystal n-GaAs substrates have been implanted at room temperature with 100 MeV 28Si ions to a dose of 1脳1018 ions/m2. The electrical behaviour of these samples has been investigated after implantation and annealing to 850 掳C by current voltage (I-V) measurements. The I-V curves show series of complex behaviours with annealing treatments. To understand this complex behaviour, Resistance measurements of these samples using I-V measurements were carried out in the temperature range 100-300 K, which indicate that the as implanted sample and samples annealed to 350 掳C are dominated by a variable range hoping conduction mechanism, where as for the samples annealed at 450 掳C and 550 掳C the electrical conduction is due to hopping between the neighboring defect sites. The electrical transport for the sample annealed at 650 掳C seems to be dominated by carriers in the extended states. At annealing temperature higher than 650 掳C, the I-V characteristics are insensitive to measurement temperatures which indicates that the backward diode like structure after 850 掳C annealing is due to the activation of Si ions and formation of n+ region at the mean ion range and the existence of defect complex p+-type conductivity immediately above that region.
机译:单晶n-GaAs衬底已在室温下注入100 MeV 28Si离子,剂量为1×1018离子/ m2。在注入和退火至850 implantC后,通过电流电压(I-V)测量对这些样品的电性能进行了研究。 I-V曲线显示了一系列经过退火处理的复杂行为。为了理解这种复杂的行为,在100-300 K的温度范围内使用IV测量对这些样品的电阻进行了测量,这表明植入的样品和退火至350°C的样品主要受可变范围跳跃传导机制的控制,对于在450掳C和550 ledC退火的样品,导电是由于相邻缺陷部位之间的跳变所致。样品在650℃退火后的电传输似乎由处于扩展状态的载流子控制。在高于650掳C的退火温度下,IV特性对测量温度不敏感,这表明850℃退火后的反向二极管状结构归因于Si离子的活化以及在平均离子范围和平均离子范围内形成的n +区。在该区域正上方存在缺陷复合物p +型电导率。

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