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Design to avoid the over-gate-driven effect on ESD protection circuits in deep-submicron CMOS processes

机译:设计避免在深亚微米CMOS工艺中对ESD保护电路产生过栅极驱动效应

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Although the gate-driven (or gate-coupled) technique was reported to improve ESD robustness of NMOS devices, the over-gate-driven effect has been found to degrade the ESD level. This effect makes the gate-driven technique difficult to be well optimized in deep-submicron CMOS ICs. In this work, a new design is proposed to overcome such over-gate-driven effect by circuit design and to achieve the maximum ESD capability of the devices. The experimental results have shown significant improvement on the machine-model (MM) ESD robustness of ESD protection circuits by this new proposed design. This new design is portable (process-migration) for applications in different CMOS processes without modifying the process step or mask layer.
机译:尽管据报道,栅极驱动(或栅极耦合)技术可提高NMOS器件的ESD鲁棒性,但已发现过栅极驱动效应会降低ESD电平。这种效应使得在深亚微米CMOS IC中很难很好地优化栅极驱动技术。在这项工作中,提出了一种新的设计,以通过电路设计克服这种过栅极驱动的影响,并实现器件的最大ESD能力。实验结果表明,通过这种新提出的设计,ESD保护电路的机器模型(MM)ESD鲁棒性得到了显着改善。这种新设计可移植(工艺移植),适用于不同的CMOS工艺中的应用,而无需修改工艺步骤或掩模层。

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