Improvement in ability of wafer-formed cleaning material 'Cleaning Wafer' to remove small particles

摘要

To minimize particles on the back surface of wafer, the operator usually cleans the wafer chuck table regularly. We have introduced a new cleaning method with the use of our wafer-formed cleaning material called "Cleaning Wafer". The Cleaning Wafer can remove particles on a chuck table without stopping the processing equipment. The Cleaning Wafer has an optimally designed cleaning layer with controlled modulus and surface roughness. We tested the particle removal performance with dry etching equipment, and the result was a dramatic decrease in the number of particles. Though many particles are generally generated during etching, it is possible that the particle number can be controlled using Cleaning Wafer regularly.