Application of memory tester for non-destructive detection of micro-crack and crack patterns in flash memory devices

摘要

In this paper, we introduces a new , non-destructive inspection technique for die crack and crack pattern using a memory tester. The concept of the technique is based upon the fact that almost ninety percent of the space of a memory device consists of cell memories, thus if microcrack is present, the phenomenon would cause malfunctioning of the memory.