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A novel technique of silicon-on-nothing MOSFETs fabrication by hydrogen and helium co-implantation

机译:氢和氦共注入制备无硅MOSFET的新技术

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In this paper a novel technique of silicon-on-nothing (SON) MOSFETs fabrication by H/sup +/ and He/sup +/ co-implantation is presented for the first time. This in-house technique is compatible with conventional CMOS technology and it can greatly alleviate the problems existing in the known techniques of SON devices. SON nMOSFETs with 50nm gate length have been fabricated and demonstrated in this paper. With the same process condition, SON MOSFETs exhibit better performance than the corresponding bulk silicon MOSFETs.
机译:本文首次提出了一种通过H / sup + /和He / sup + /共注入制造无硅(SON)MOSFET的新技术。此内部技术与常规CMOS技术兼容,并且可以大大缓解SON器件已知技术中存在的问题。本文制造并演示了栅极长度为50nm的SON nMOSFET。在相同的工艺条件下,SON MOSFET的性能要优于相应的体硅MOSFET。

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