Hybrid numerical-asymptotic method for the calculation of the coupling between elements of a conformal microstrip patch array

摘要

Efficient asymptotic solutions have been developed for the calculation of the self and mutual coupling between patches on a curved 2D surface with variable curvature. For the calculation of the mutual coupling the approach is based on a local circular cylindrical approximation of the surface and on an asymptotic evaluation of the exact dyadic Green's function for a substrate on a circular cylinder. For the calculation of the self-coupling of a patch the curvature of the substrate is neglected and the corresponding Green's function is replaced by the Green's function of a planar layer. The Sommerfeld integrals are calculated by using the Discrete Complex Image Method after having extracted the surface wave contributions. The dyadic Green's function based on the two approaches is introduced in the mixed potentials electric field integral equation which is solved by using the RWG (Rao, Wilton, Glisson) triangular basis functions.