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Polysilicon surface micromachined structural entities with continuous hinges and microrivets for assembling three-dimensional mems devices

机译：具有连续铰链和微铆钉的多晶硅表面微加工结构实体，用于组装三维记忆体器件

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《》|2001年|P.74-78|共5页
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Kolesar; E.S.; Ruff; M.D.; Odom; W.E.;
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中图分类无线电电子学、电信技术;
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2. A flip-chip encapsulation method for packaging of MEMS actuators using surface micromachined polysilicon caps for BioMEMS applications [J] . Panchawagh HV, Faheem FF, Herrmann CF, Sensors and Actuators, A. Physical . 2007,第1期

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3. Scale dependence of tensile strength of micromachined polysilicon MEMS structures due to microstructural and dimensional constraints [J] . Ding Jianning, Meng Yonggang, Wen Shizhu Chinese science bulletin . 2001,第16期

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4. Polysilicon surface micromachined structural entities with continuous hinges and microrivets for assembling three-dimensional MEMS devices [C] . Edward S. Kolesar, Matthew D. Ruff, William E. Odom, IEEE Emerging Technologies Symposium on BroadBand Communications for the Internet Era . 2001

机译：多晶硅表面微机械结构实体，用于组装三维MEMS器件的连续铰链和微血管
5. Solder self-assembled, surface micromachined MEMS for micromirror applications and atom trapping. [D] . McCarthy, Brian. 2004

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6. Microfluidic and Micromachined/MEMS Devices for Separation, Discrimination and Detection of Airborne Particles for Pollution Monitoring [O] . Daniel Puiu Poenar 2015

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8. Microelectro-optical devices in a 5-level polysilicon surface micromachining technology [R] . Smith, J. H. , Rodgers, M. S. , Sniegowski, J. J. , 1998

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Polysilicon surface micromachined structural entities with continuous hinges and microrivets for assembling three-dimensional mems devices

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