First International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. Incorporating POLY, PEP Adhesives in Electronics. Proceedings (Cat. No.01TH8592)

摘要

The following topics are dealt with: enabling technologies; polymer electronic devices; isotropic conductive adhesives; encapsulation technologies for flip chip; reliability; advanced packaging applications; polymer substrates; materials development; photonic polymers; flexible systems; materials testing and characterization.