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Contact resistance and fretting corrosion of lead-free alloy coated electrical contacts

机译:无铅合金涂层电触点的接触电阻和微动腐蚀

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As lead-free solders replace tin-lead solders in soldering, it is also expected that lead-free solder alloys will be used as contact finish materials for electrical contacts. In this study, the contact resistance and fretting corrosion of tin-silver-copper and tin-copper coatings were investigated and compared with tin-lead eutectic coating. The contact resistance before after different aging conditions, including mixed flowing gas, steam, and dry heat aging, was examined. Tin-silver-copper and tin-lead alloy coatings have similar performance on contact resistance versus contact normal force after dry heat aging and MFG aging. Severe degradation was found on tin-silver-copper coatings after steam aging. Higher contact force is suggested in the application of tin-silver-copper solder alloy coating than for eutectic tin-lead alloy coatings. Fretting corrosion on tin-silver-copper and tin-copper lead-free alloy coatings was studied and compared with tin-lead coating. Fretting corrosion experiments were conducted and compared at different temperatures and normal forces. In general, tin-silver-copper and tin-copper alloys show equal or better fretting corrosion resistance than tin-lead eutectic alloy at the experimental conditions in this study.
机译:随着无铅焊料在焊接中替代锡铅焊料,人们还期望将无铅焊料合金用作电触头的触头表面处理材料。在这项研究中,研究了锡-银-铜和锡-铜涂层的接触电阻和微动腐蚀,并将其与锡铅共晶涂层进行了比较。检查了不同老化条件(包括混合流动的气体,蒸汽和干热老化)之后的接触电阻。在干热老化和MFG老化之后,锡-银-铜和锡-铅合金涂层在接触电阻与接触法向力方面具有相似的性能。蒸汽老化后,发现锡银铜涂层严重降解。建议在锡银铜焊料合金涂层中使用比共晶锡铅合金涂层更高的接触力。研究了锡银铜和锡铜无铅合金涂层的微动腐蚀,并与锡铅涂层进行了比较。进行了微动腐蚀实验,并在不同温度和法向力下进行了比较。通常,在本研究中,锡银铜合金和锡铜合金与锡铅共晶合金表现出相同或更好的耐微动腐蚀性能。

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