optical communication equipment; integrated optoelectronics; semiconductor device packaging; integrated circuit packaging; optical fibre communication; surface mount technology; surface emitting lasers; moulding; flip-chip devices; microassembling; optical SMT-packaging; fiber optic components; VCSEL; nonoptical transparent mould compound; metallic lead frame optical access aperture; optical fiber attachment; optical clear plane; lensed window; single mode-fiber coupling; fiber optical transmission rates; focused light transmission; flip-chip technology; chip on chip technology; hybrid assembling; assembling technology; multichip-configurations; optical passive chips; optical active chips; optical-TSSOP10; 1300 nm; 10 Gbit/s;
机译:大量生产用于电信和数据通信应用的高度可靠的光纤组件的微系统和晶圆工艺
机译:基于混合的FSO /光纤链路可靠与节能WDM光网络架构
机译:高效光纤照明器设计中的光学组件关系
机译:一种使用1300nm光学元件的新型光纤压力传感器
机译:使用光频率梳的可重构高速光信号处理,用于大容量,高效光谱的光纤系统和网络
机译:基于自适应光纤准直器阵列的高效相干保形投影系统
机译:使用高效氧化物限制的GaAs VCSEL源在大温度范围内进行光学数据传输
机译:光纤sonobuoy Link开发-FY 78.用于光学数据链路的光纤元件,用于将浸入式水听器组件与5 km深度sonobuoy的表面发射器互连。