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The study of etching selectivity between InGaAs and AlGaAs in acid based etching solution

机译:酸基蚀刻液中InGaAs和AlGaAs之间蚀刻选择性的研究

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The etching selectivity of AlGaAs and InGaAs was studied and analyzed. Different chemical solutions and compositions were varied to study the etch rate effect between these two materials. The etching rates and selectivity of the H/sub 3/PO/sub 4/:H/sub 2/O/sub 2/:H/sub 2/O, H/sub 2/SO/sub 4/:H/sub 2/O/sub 2/:H/sub 2/O and C/sub 6/H/sub 8/O/sub 7/:H/sub 2/O/sub 2/ is compared. The results show that the C/sub 6/H/sub 8/O/sub 7/:H/sub 2/O/sub 2/ chemical solution exhibits higher etch rate and significant selectivity in comparison with H/sub 3/PO/sub 4/:H/sub 2/O/sub 2/:H/sub 2/O, H/sub 2/SO/sub 4/:H/sub 2/O/sub 2/:H/sub 2/O.
机译:对AlGaAs和InGaAs的刻蚀选择性进行了研究和分析。改变不同的化学溶液和组成以研究这两种材料之间的蚀刻速率效应。 H / sub 3 / PO / sub 4 /:H / sub 2 / O / sub 2 /:H / sub 2 / O,H / sub 2 / SO / sub 4 /:H / sub的蚀刻速率和选择性比较2 / O / sub 2 /:H / sub 2 / O和C / sub 6 / H / sub 8 / O / sub 7 /:H / sub 2 / O / sub 2 /。结果表明,与H / sub 3 / PO /相比,C / sub 6 / H / sub 8 / O / sub 7 /:H / sub 2 / O / sub 2 /化学溶液具有更高的蚀刻速率和显着的选择性。 sub 4 /:H / sub 2 / O / sub 2 /:H / sub 2 / O,H / sub 2 / SO / sub 4 /:H / sub 2 / O / sub 2 /:H / sub 2 / O 。

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