Thermal behavior of solder bonded and adhesive bonded folded fin assemblies

摘要

The rapid advancement in technology of microprocessors has lead electronics thermal system designers to pay increased attention to the folded fin heat sink. The advantages of folded fin heat sinks are lightweight, low profile, and small footprint. This paper presents the theoretical study of thermal contact resistance of different types of bonding at the joint between the folded fin base and the spreader plate of the heat sink, and also the effect of fin thickness on overall thermal resistance. Experimental work is carried out to validate this theoretical analysis.