Design and fabrication of 600 DPI light-emitting diode printheads using precision flip-chip solder bump technology

摘要

We have described the design and fabrication of a 600 DPI LED printhead using solder bumped flip chip assembly technology. This combination of high performance and low manufacturing cost would have been difficult or impossible to achieve with wire bonding. The benefits of flip chip assembly technology over conventional wire bonding techniques also include reduced LED and IC wafer area for equivalent function, improved reliability, greatly reduced product size and weight, and the ability to easily rework the printhead if necessary.