A two-phase push-pull cooling module has been developed for cooling a pin-fin array electronic device. The measured results indicate that when the pin-fin array density is increased the performance of the push-pull module is better than that of traditional forced convection. It was also found that in forced convection cooling the temperature in the downstream region is much higher than that of the front region. In comparison, the temperature distribution in the two-phase push-pull cooling module is quite uniform.
展开▼
