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A 0.5- mu m BiCMOS technology for logic and 4 Mbit-class SRAMs

机译:用于逻辑和4 Mbit级SRAM的0.5μmBiCMOS技术

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The authors describe a 0.5- mu m BiCMOS technology for high-performance logic and SRAMs (static RAMs) which is capable of supporting 5-V hot-carrier-hard circuit designs. In these designs the maximum drain-to-source voltage across a 0.5- mu m NMOS device is restricted to 4 V to ensure hot carrier reliability using 12-nm gate oxide. However, for the bipolar device, isolation and longer channel MOS devices, the process is required to support 5 V. For a 5-V supply voltage, the capacitive load drive factor for a BiCMOS NAND gate is 160 ps/pF, which is 30% smaller than the load drive factor for the same basic design gate built using an 0.8- mu m process with 20-nm gate oxide. The authors also discuss how a vertical NMOS driver transistor and a polysilicon PMOS load device are integrated into the 0.5- mu m BiCMOS process. The addition of these components permits a 23- mu m/sup 2/ stacked 6-T CMOS SRAM cell to be realized, suitable for 4-Mb-class BiCMOS SRAMs.
机译:作者介绍了一种用于高性能逻辑和SRAM(静态RAM)的0.5μmBiCMOS技术,该技术能够支持5V热载子硬电路设计。在这些设计中,整个0.5μmNMOS器件的最大漏极-源极电压限制为4 V,以确保使用12 nm栅氧化层的热载流子可靠性。但是,对于双极型器件,隔离和更长通道的MOS器件,要求该工艺支持5V。对于5V的电源电压,BiCMOS NAND门的电容负载驱动因子为160 ps / pF,为30比使用0.8-μm工艺和20-nm栅氧化层构建的相同基本设计栅的负载驱动因子小%。作者还讨论了如何将垂直NMOS驱动器晶体管和多晶硅PMOS负载器件集成到0.5微米的BiCMOS工艺中。这些组件的添加允许实现23μm/ sup 2 /堆叠的6-T CMOS SRAM单元,适用于4-Mb级BiCMOS SRAM。

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