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As-deposited low-strain LPCVD polysilicon

机译:沉积低应变LPCVD多晶硅

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As-deposited polysilicon films with very low residual strain (lower than 5*10/sup -5/) are obtained by a low-pressure, chemical-vapor-deposition (LPCVD) process. Straight polysilicon bridges 300 mu m long, 1.2 mu m thick, and 2 to 20 mu m wide, have been made using this process. No buckling has been observed in any of the nearly 1000 bridges of this type made in two separate process runs. In addition, no problems of sticking between the bridges and the substrate were encountered with these structures.
机译:通过低压化学气相沉积(LPCVD)工艺可获得具有非常低的残余应变(低于5 * 10 / sup -5 /)的沉积态多晶硅膜。使用这种方法已经制成了300微米长,1.2微米厚,2至20微米宽的直多晶硅桥。在两个单独的过程中,在将近1000个这种类型的桥中,没有观察到屈曲。另外,在这些结构中,没有遇到桥与基板之间的粘着问题。

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