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Design of a Terabit Free-Space Photonic Backplane for Parallel Computing

机译:用于并行计算的兆兆位自由空间光子底板的设计

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The design of a terabit free-space photonic backplane for parallel computing and communications is described. The backplane consists of a large number of parallel reconfigurable optical channels spaced a few hundred microns apart. The parallel channels are organized as a unidirectional ring and the channel access protocols are implemented by smart pixel arrays. Smart pixel arrays are integrated opto-electronic devices with optical I/O and with electronic processing capabilities. The design of a 32×32 smart pixel array which supports multiple reconfigurable broadcast channels and interfaces between tens of Gb/s of electrical data and hundreds of Gb/s of optical data is proposed. The photonic backplane interconnects 32 Printed Circuit Boards (PCBs) and has a bisection bandwidth of 1 terabit/sec (Tb/s), with each PCB receiving a bandwidth of 32 Gb/s. The backplane can be dynamically reconfigured to support 1024 broadcast channels at 1 Gb/s, 32 broadcast channels at 32 Gb/s, or many intermediate values. The backplane can also embed arbitrary graphs, including meshes, hypercubes, shuffles, etc. Smart pixel arrays are currently being fabricated using AT&T's Hybrid-SEED process, and a demonstration of the architecture interconnecting 4 PCBs is planned for the fall of 1995.
机译:描述了用于并行计算和通信的千兆位自由空间光子底板的设计。背板由间隔数百微米的大量并行可重配置光通道组成。并行通道组织为单向环,通道访问协议由智能像素阵列实现。智能像素阵列是具有光学I / O和电子处理功能的集成光电设备。提出了一种32×32智能像素阵列的设计,该阵列支持多个可重新配置的广播通道以及数十Gb / s的电数据和数百Gb / s的光数据之间的接口。光子背板将32个印刷电路板(PCB)互连,并具有1 TB /秒(Tb / s)的对分带宽,每个PCB接收32 Gb / s的带宽。可以将背板动态地重新配置为支持1024广播通道(1 Gb / s),32广播通道(32 Gb / s)或许多中间值。背板还可以嵌入任意图形,包括网格,超立方体,混洗等。目前正在使用AT&T的Hybrid-SEED工艺制造智能像素阵列,并计划在1995年秋季演示互连4个PCB的体系结构。

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