FEASIBILITY ANALYSIS METHODOLOGY FOR STACKED-DIE VS. SINGLEDIE PACKAGE CONSIDERATIONS

摘要

Industry trends have led a number of companies, includingrnMotorola, to investigate the technical and cost trade-offs ofrnsingle versus stacked-die packaging options. The widernapplication possibilities for stacked-die packaging across thernsemiconductor industry has raised the question of whenrnthese solutions are best suited for new applications. Earlyrntechnical and cost feasibility analyses are critical tornunderstanding the packaging solution benefits and risks asrnwell as highlighting the key technical considerations thatrncan enable the most cost effective and manufacturablernsolution. Feasibility considerations such as: package area,rnpackage & assembly cost, die & assembly yields, substraterndesign complexity, manufacturability, die aspect ratios,rnperformance, customer requirements and test methodologyrnare areas that need to be investigated to help make earlyrndecisions on the type of packaging option that is mostrnsuitable for the application being considered. This paperrnwill discuss the feasibility analysis methodology andrnconsiderations for stacked-die versus single-die packagernoptions and show a number of ways to mitigate some of thernmanufacturing risks associated with stacked-die packaging