Yet More Analysis from the Alternate Finishes Task Group Report on Time, Temperature and Humidity Stress of Final Board Finish Solderability

摘要

The data from the IPC Alternate Finishes Task Group Report "Time, Temperature and Humidity Stress for Final Finish Board Solderability" has been analyzed in a greater depth than in the actual report or a subsequent paper2. Thermodynamically-based equations have been developed that are a better fit for the data than the intuitive ordering of the data in the report. Equations for the solderability results for the immersion silver, immersion tin, reflowed tin/lead, OSP and ENIG and the bare copper finishes studied in the IPC report are included here.