首页> 外文会议>IPC Electronic Circuits World Convention, Printed Circuits Expo, Apex, and the Designers Summit 2005(ECWC 10): The Perfect Fit vol.2 >Optimised Vertical Process for Microvia Filling and Through Hole Metallization Under Production-like Conditions
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Optimised Vertical Process for Microvia Filling and Through Hole Metallization Under Production-like Conditions

机译:在生产条件下优化微通孔填充和通孔金属化的垂直工艺

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摘要

This article summarises how a copper metallization process for simultaneous via filling and through hole plating was developed on a laboratory scale and the challenges encountered by scale-up to larger industrial like electrolyte volumes. Uniform filling and through hole plating on large PWBs was successfully achieved by combining various technologies for achieving uniform current distribution, hence good via filling efficiency and PTH metallization, independent of sizes and location on the board surface. Both panel and patterned boards were treated.
机译:本文总结了如何在实验室规模上开发用于同时进行通孔填充和通孔电镀的铜金属化工艺,以及将其放大到更大的工业规模(如电解液)所面临的挑战。结合各种技术以实现均匀的电流分布,从而成功地在大型PWB上实现了均匀填充和通孔电镀,从而实现了良好的过孔填充效率和PTH金属化,而不受板尺寸和位置的影响。面板和图案板均被处理。

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